Compact
System-on-Package (SOP) Architectures for low cost RF Front-end modules
J. Laskar, S. Pinel,
K. Lim, A. Raghavan, R. Li, C-H. Lee, M. Maeng, M.F. Davis, M. Tentzeris.
e-mail: laskar@ece.gatech.edu
Abstract
This paper presents the
development of RF System-on-Package (SOP) architectures for compact and
low cost wireless radio front-end systems. We present multi-layer
Ceramic-based module development such as a 2.4 GHz SiGe HBT power amplifier
module with a harmonic suppression filter implemented in LTCC substrate
and a via-fed stacked cavity-backed patch antenna designed to fully cover
the required band (5.725-5.825 GHz). Multi-layer organic packaging
development for SOP is reported. A C-band up-converter MMIC integrated
with a square patch resonator band pass filter and an Intelligent
Network Communicator (INC) RF block are presented as example of the high
performances of multi-layer organic package.